Research on Key Technologies of Diamond Wire Saw Machining in Hard-brittle Material with Ultrasonic Vibration
Abstract
In the paper, the new process of rotating electroplated diamond wire saw with ultrasonic vibration is used for cutting and machining the typical hard-brittle materials like glass and zirconia ceramics to analyze its kinematics, dynamics and other basic theories, moreover, the impact rules of wire saw rotating frequency, lateral pressure, abrasive grain and other process parameters on the machining sawing power and surface roughness are researched based on the experiment. The comparison between normal sawing and ultrasonic sawing in glass indicates that: under the same condition, the tangent-saw force of ultrasonic saving is lower than that of normal sawing by 20%~30%, and the normal sawing force is decreased when the lateral pressure of workpiece is small (less than 5N) and increased when the lateral pressure is large (5N or above); when the wire saw rotating frequency is 150rpm, the lateral pressure is 2N and the abrasive grain is 280#, the machining surface will be given with the best quality with surface roughness of Ra=0.3-0.4μm. Therefore, compared to the surface roughness of Ra=0.8-1.0μm of normal sawing under the same condition, the ultrasonic sawing is superior to the normal sawing by 1-2 levels.
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